Bonding the technology together – Intel and Nokia partnership
The Finnish mobile maker Nokia is keen on making a technological bond with Intel, the world’s largest chip deviser. The nexus will result with an architecture-based mobile computing device and chipset architectures. Of the two, Intel is quite fortunate to benefit out of this deal as it will dare the doyen in mobile chip Texas Instruments and Qualcomm. The deal is a continuum of Intel’s entry as it had already made a deal with LG for Intel Atom core chip, a device enhancing the speed of mobile internet. With 40% share in Mobile market Nokia will enter the deal with Intel which boasts with 80% of the fastest supercomputers.
The new device will couple powerful computers of high-band width mobile broadband communications and Internet connectivity. The new mobile will surpass the existing smartphones, notebooks and netbooks by encompassing innovative hardware, software and mobile Internet services. With the new deal chip design and open source(Linux) software will be devised by both the companies. Under the agreement, Intel will be eligible with a license for Nokia’s HSDPA/3G modem technologies for flexible and comprehensive computing , and the best-in-class 3GPP modem technology for Intel Architecture based platforms.
Next, Intel will get the Nokia HSPA/ 3G modem IP license to complement its broadband wireless technologies. The Linux-based OS called Moblin, for portable devices will be operated by Intel and in turn Nokia will handle Maemo, a Linux based OS for new mobile device developments. Both the companies view this deal as a step ahead in the future technology and a means to execute the commitment to the mobile computing.